 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| BYV32, BYVF32 & BYVB32 Series Vishay Semiconductors formerly General Semiconductor Dual Ultrafast Rectifiers Reverse Voltage 50 to 200V Forward Current 18A Reverse Recovery Time 25ns ITO-220AB (BYVF32 Series) 0.405 (10.27) 0.383 (9.72) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.185 (4.70) 0.175 (4.44) 0.154 (3.91) 0.370 (9.40) 0.360 (9.14) 0.148 (3.74) 0.113 (2.87) 0.103 (2.62) 0.145 (3.68) 0.135 (3.43) 0.410 (10.41) 0.390 (9.91) 1 0.160 (4.06) 0.140 (3.56) PIN 2 3 0.603 (15.32) 0.573 (14.55) 1 TO-220AB (BYV32 Series) 0.415 (10.54) MAX. 0.140 (3.56) DIA. 0.130 (3.30) 0.131 (3.39) DIA. 0.122 (3.08) 0.055 (1.39) 0.045 (1.14) 0.600 (15.5) 0.580 (14.5) PIN 2 3 0.676 (17.2) 0.646 (16.4) 0.350 (8.89) 0.330 (8.38) 0.635 (16.13) 0.625 (15.87) 0.350 (8.89) 0.330 (8.38) 0.191 (4.85) 0.171 (4.35) 0.560 (14.22) 0.530 (13.46) 0.060 (1.52) PIN 1 PIN 3 PIN 2 1.148 (29.16) 1.118 (28.40) 0.110 (2.79) 0.100 (2.54) 0.560 (14.22) 0.530 (13.46) 0.110 (2.80) 0.100 (2.54) PIN 1 PIN 3 PIN 2 CASE 0.105 (2.67) 0.095 (2.41) 0.037 (0.94) 0.027 (0.69) 0.022 (0.55) 0.014 (0.36) 0.105 (2.67) 0.095 (2.41) 0.104 (2.65) 0.096 (2.45) 0.035 (0.90) 0.028 (0.70) 0.205 (5.20) 0.195 (4.95) 0.022 (0.56) 0.014 (0.36) 0.205 (5.20) 0.195 (4.95) TO-263AB (BYVB32 Series) 0.411 (10.45) 0.190 (4.83) 0.160 (4.06) 0.055 (1.40) 0.045 (1.14) 0.380 (9.65) 0.245 (6.22) MIN K 0.33 (8.38) Mounting Pad Layout TO-263AB 0.42 (10.66) Dimensions in inches and (millimeters) 0.360 (9.14) 0.320 (8.13) 0.624 (15.85) 1 K 2 0.591 (15.00) 0.055 (1.40) 0.047 (1.19) 0.63 (17.02) 0-0.01 (0-0.254) 0.110 (2.79) 0.090 (2.29) 0.037 (0.940) 0.08 (2.032) 0.24 (6.096) 0.027 (0.686) 0.12 (3.05) PIN 1 PIN 2 K - HEATSINK 0.021 (0.53) 0.014 (0.36) 0.140 (3.56) 0.110 (2.79) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) Features * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Dual rectifier construction, positive centertap * Glass passivated chip junctions * Low power loss * Low forward voltage, high current capability * High surge current capability * Superfast recovery times for high efficiency Mechanical Data Case: JEDEC TO-220AB, ITO-220AB & TO-263AB molded plastic body Terminals: Plated leads, solderable per MIL-STD-750, Method 2026 High temperature soldering guaranteed: 250C, 0.16" (4.06mm) from case for 10 seconds Polarity: As marked Mounting Position: Any Mounting Torque: 10 in-lbs maximum Weight: 0.08 oz., 2.24 g www.vishay.com 1 Document Number 88558 26-Mar-03 BYV32, BYVF32 & BYVB32 Series Vishay Semiconductors formerly General Semiconductor Maximum Ratings Parameter (TC = 25C unless otherwise noted) Symbol VRRM VRMS VDC IF(AV) IFSM TJ, TSTG VISOL BYV32-50 BYV32-100 BYV32-150 BYV32-200 50 35 50 100 70 100 18 150 -65 to +150 4500 3500 1500 (1) (2) (3) Unit V V V A A C V Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC = 125C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) per leg Operating junction and storage temperature range RMS Isolation voltage (BYVF type only) from terminals to heatsink with t = 1.0 second, RH 30% 150 105 150 200 140 200 Electrical Characteristics (TC = 25C unless otherwise noted) Parameter Maximum instantaneous forward voltage per leg at: at IF = 20A at IF = 5.0A, TJ = 100C Maximum DC reverse current per leg at rated DC blocking voltage TJ = 25C TJ = 100C (4) Symbol VF BYV32-50 BYV32-100 BYV32-150 BYV32-200 1.15 0.85 10 600 25 45 Unit V A ns pF IR trr CJ Maximum reverse recovery time per leg at IF = 1A, VR = 30V, di/dt = 100A/s, Irr = 10% IRM Typical junction capacitance per leg at 4V, 1MHz Thermal Characteristics (TC = 25C unless otherwise noted) Parameter Thermal resistance from junction to case per leg Symbol RJC BYV 1.6 BYVF 5.0 BYVB 1.6 Unit C/W Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110" offset (2) Clip mounting (on case), where leads do overlap heatsink (3) Screw mounting with 4-40 screw, where washer diameter is 4.9mm (0.19") (4) Pulse test: 300s pulse width, 1% duty cycle www.vishay.com 2 Document Number 88558 26-Mar-03 BYV32, BYVF32 & BYVB32 Series Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (TA = 25C unless otherwise noted) Forward Current Derating Curve 20 150 Resistive or Inductive Load Maximum Non-Repetitive Peak Forward Surge Current Per Leg Peak Forward Surge Current (A) TJ = 150C 10ms Single Half Sine-Wave (JEDEC Method) Average Forward Rectified Current (A) 18 16 125 100 75 50 25 12 8.0 4.0 0 0 0 25 50 75 100 125 150 1 10 100 Case Ambient Temperature (C) Number of Cycles at 50 HZ Typical Instantaneous Forward Characteristics Per Leg IF - Instantaneous Forward Current (A) 100 1000 Typical Reverse Leakage Characteristics Per Leg 10 TJ = 125C IR - Instantaneous Reverse Leakage Current (mA) 100 TC = 100C 1 TJ = 25C 10 0.1 Pulse Width = 300s 1% Duty Cycle 0.01 0.1 1 TC = 25C 0.1 0.3 0.5 0.7 0.9 1.1 1.3 0 20 40 60 80 100 Instantaneous Forward Voltage (V) Percent of Rated Peak Reverse Voltage (%) Typical Junction Capacitance Per Leg 60 TJ = 25C f = 1.0 MHZ Vsig = 5mVp-p pF - Junction Capacitance 50 40 30 20 10 0 1 10 100 Reverse Voltage (V) Document Number 88558 26-Mar-03 www.vishay.com 3 |
Price & Availability of BYV32
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |